Electronic chemicals

HEXADIMETHRINE BROMIDE

CasNo:28728-55-4

Molecular Formula:C39H90Br6N6X2

Specifications:>0.97

4-(Dimethylamino)pyridine, polymer-bound

CasNo:82942-26-5

Molecular Formula:C8H8

Specifications:>0.97

Bis(4-chlorophenyl) sulfone-bis(4-hydroxyphenyl) sulfone copolymer

CasNo:25608-63-3

Molecular Formula:C24H18Cl2O6S2

Specifications:>Tg 192 °C

Polyoxyl 15 Hydroxystearate

CasNo:70142-34-6

Molecular Formula:(C18H36O3.(C2H4O)nH2O)x

Specifications:>free macrogoly, 25-40%

Polydioxanone

CasNo:31621-87-1

Molecular Formula:C4H6O3X2

Specifications:>inherent viscosity<3.0dl/g

Wangresin

CasNo:201058-08-4

Molecular Formula:C15H16O2

Specifications:>0.98

Dowex 50 wx8

CasNo:11119-67-8

Molecular Formula:无

Specifications:>hydrogen form,50-100 mesh

MERRIFIELD RESIN

CasNo:70024-51-0

Molecular Formula:C36H36Cl2

Specifications:>0.5-2.5mmol/g

Amberlyst 15(H) ion-exchange resin

CasNo:9037-24-5

Molecular Formula:C3H7BrO

Specifications:><1.5%H2O

Methyl 7-oxabicyclo[4.1.0]heptane-3-carboxylate

CasNo:41088-52-2

Molecular Formula:C8H12O3

Specifications:>0.95

Amberlite IR 120

CasNo:9002-23-7

Molecular Formula:-[SO2HC6H4CHCH2]CHCH2C6H4CHCH2-

Specifications:>Na form

RINK AMIDE AM RESIN

CasNo:183599-10-2

Molecular Formula:C39H35N2O6R

Specifications:>100-200 mesh 0.6-0.8mmol/g