Electronic chemicals

2,6-Dimethylbenzene-1,4-diamine

CasNo:7218-02-2

Molecular Formula:C8H12N2

Specifications:>0.95

(E)-4,4'-(Ethene-1,2-diyl)dianiline

CasNo:7314-06-9

Molecular Formula:C14H14N2

Specifications:>0.97

4,4'-(Ethane-1,2-diylbis(oxy))dianiline

CasNo:6052-10-4

Molecular Formula:C14H16N2O2

Specifications:>0.95

2,3,5,6-Tetramethylterephthalaldehyde

CasNo:7072-01-7

Molecular Formula:C12H14O2

Specifications:>0.97

Pyridine-2,5-dicarbaldehyde

CasNo:6221-01-8

Molecular Formula:C7H5NO2

Specifications:>0.97

2,2'-Bipyridine-3,3'-dicarboxylic acid

CasNo:

Molecular Formula:C12H8N2O4

Specifications:>0.9

5-(2-Fluoropyridin-4-yl)isophthalic acid

CasNo:

Molecular Formula:C13H8FNO4

Specifications:>0.97

3-Aminonaphthalene-1,5-disulfonic acid hydrate

CasNo:

Molecular Formula:C10H11NO7S2

Specifications:>0.95

Methoxy-poly(ethylene glycol)-block-poly(L-lysine hydrochloride)

CasNo:

Molecular Formula:无

Specifications:>mPEG5K-b-PLKC10,average MW 6600

Fmoc-Gly-Wang resin 100-200 mesh, 1% DVB

CasNo:

Molecular Formula:C17H14NO3R

Specifications:>0.3-0.8mmol/g

Fmoc-Ala-Wang resin 100-200 mesh, 1% DVB

CasNo:

Molecular Formula:无

Specifications:>0.3-0.8mmol/g

Fmoc-Asp(OtBu)-Wang resin 100-200 mesh, 1% DVB

CasNo:

Molecular Formula:无

Specifications:>0.3-0.8mmol/g